POWDERED SEALANT AND SEALING METHOD

摘要

Provided is a sealant which can be used to ensure a close seal of electronic devices at low temperatures. Also provided is a sealing method. A sealant for sealing a device by molding comprises a powdered copolymer polyamide resin. The copolymer polyamide resin may have crystalline properties, and the melting point or softening point of the copolymer polyamide resin may fall within the range of 75 to 160°C. The copolymer polyamide resin may be a multi-component copolymer, for example, a binary or a ternary copolymer. Moreover, the copolymer polyarmide resin may contain units derived from long-chain components having a C8-16 alkylene group (at least one type of component selected from C9-17 lactam and amino C9-17 alkane carboxylic acid).