发明名称 |
SAWING APPARATUS OF SINGLE CRYSTAL THE SAME |
摘要 |
PURPOSE: An apparatus for cutting a single crystal ingot is provided to improve the quality of nanotopography by stably supplying slurry when slurry flux is reduced. CONSTITUTION: A wire saw(220) cuts an ingot. A roller(210) runs the wire saw. A slurry nozzle part(230) supplies slurry to a wire. The slurry nozzle part is transferable according to the cutting degree of the ingot. The slurry nozzle part moves from near to far from the ingot or from side to side as the ingot is cut.
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申请公布号 |
KR20120030696(A) |
申请公布日期 |
2012.03.29 |
申请号 |
KR20100092370 |
申请日期 |
2010.09.20 |
申请人 |
LG SILTRON INCORPORATED |
发明人 |
KIM, NAM JAE;CHO, HEE DON;JI, DONG OUK |
分类号 |
H01L21/301 |
主分类号 |
H01L21/301 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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