| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive tape having excellent heat resistance, namely, a pressure-sensitive adhesive tape whose tape surface hardly thermally-fuses after sticking. <P>SOLUTION: The pressure-sensitive adhesive tape includes a heat-resistant layer, a base material layer and a pressure-sensitive adhesive layer in this order, wherein: an elastic modulus (Young's modulus) thereof at 25°C is ≤150 MPa; the heat-resistant layer contains a polypropylene-based resin polymerized by using a metallocene catalyst; a melting point of the polypropylene-based resin is 110-200°C; and a molecular weight distribution (Mw/Mn) of the polypropylene-based resin is ≤3. <P>COPYRIGHT: (C)2012,JPO&INPIT |
