发明名称 ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
摘要 An adhesive sheet comprising a release substrate 10, a substrate film 14, and a first tacky-adhesive layer 12 placed between the release substrate 10 and the substrate film 14, wherein an annular incision D is formed on the release substrate 10 from the surface of the first tacky-adhesive layer 12 side, the first tacky-adhesive layer 12 is laminated so as to cover the whole inner surface of the incision D in the release substrate 10, and the incision D has a depth d of less than the thickness of the release substrate 10 and 25 μm or less.
申请公布号 US2012073743(A1) 申请公布日期 2012.03.29
申请号 US201113310531 申请日期 2011.12.02
申请人 发明人 TANAKA MAIKO;URUNO MICHIO;MATSUZAKI TAKAYUKI;FURUTANI RYOJI;MASHINO MICHIO;INADA TEIICHI
分类号 B32B37/16;B32B7/06 主分类号 B32B37/16
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