发明名称 |
ELECTRONIC PACKAGE STRUCTURE |
摘要 |
An electronic package structure is provided. The electronic package structure comprises a substrate, a first electronic element, and a second electronic element. The substrate includes a heat-dissipating plate and a circuit board disposed on the heat-dissipating plate. The first electronic element is disposed on the heat-dissipating plate and coupled to the circuit board. The second electronic element is disposed on the circuit board and coupled to the circuit board. |
申请公布号 |
US2012075808(A1) |
申请公布日期 |
2012.03.29 |
申请号 |
US201113206810 |
申请日期 |
2011.08.10 |
申请人 |
LEE HAN-HSIANG;LIN YI-CHENG;HUNG PEI-CHUN;LU BAU-RU;CHEN DA-JUNG;LI JENG-JEN |
发明人 |
LEE HAN-HSIANG;LIN YI-CHENG;HUNG PEI-CHUN;LU BAU-RU;CHEN DA-JUNG;LI JENG-JEN |
分类号 |
H05K7/20;H05K7/00 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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