| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package substrate unit and manufacturing method therefor, capable of improving connection reliability between a solder bump on a semiconductor chip and a solder bump on a package substrate unit, with a narrowed pitch between solder bumps. <P>SOLUTION: A semiconductor chip mounting layer 20 of a package substrate unit 1 includes: an insulation layer 21; a conductive plating sheet layer 22a formed on the upper surface of the insulation layer 21; a conductive pad 23 formed on the upper surface of the conductive plating sheet layer 22a; a metallic post 24 formed in a substantially central portion of the conductive pad 23; and a solder resist layer 25 formed in a manner to enclose the conductive pad 23 and the metallic post 24. <P>COPYRIGHT: (C)2012,JPO&INPIT |
