| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a substrate processing method for removing pollution substances such as particles adhered on substrate surfaces, which is capable of demonstrating high performance in removing particles and so on in addition to exhibiting high throughput. <P>SOLUTION: It is possible to enhance removal efficiency of particles by lowering the achieving temperature of a liquid film LF (coagulation film FF) after freezing. Moreover, since the coolant gas flow rate is changed before and after forming the coagulation film FF over entire substrate surface Wf, it is possible to remove the particles and so on excellently and efficiently while reducing the time required for the processing. Particularly, although it is necessary to reduce the coolant gas flow rate in a liquid film LF freezing phase to the degree such that the liquid film LF on the substrate surface Wf would not be blown off, there is no such restriction in the phase after entirely forming the coagulation film FF which enables the increase of the coolant gas flow rate, resulting in the enhancement of the coolant capability. <P>COPYRIGHT: (C)2012,JPO&INPIT |
