| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a joining material that can stably mount a semiconductor device, on which an Sn-Ag based solder ball, such as Sn-3Ag-0.5Cu or Sn-3Ag, which is widely distributed in the current market is mounted, on a substrate at the low temperature of 180°C or less so as to enhance mechanical reliability, and also reduce the increase in electrical resistance over time. <P>SOLUTION: The joining material contains: a solder alloy with a melting point of 180°C or less; and 90 wt.% or more of either one kind or more of Bi or In. <P>COPYRIGHT: (C)2012,JPO&INPIT |
