| 摘要 |
<P>PROBLEM TO BE SOLVED: To enhance image quality of a solid state image pick-up device by minimizing intrusion of light emitted from an active element such as a transistor, a diode, or the like, during operation into a photoelectric conversion part. <P>SOLUTION: The solid state image pick-up device 28 comprises a pixel region 23 which is formed on the light incident side of a substrate and in which multiple pixels including a photoelectric conversion part PD are arranged, and a peripheral circuit 25 which is formed below the pixel region 23 in the depth direction of the substrate and includes active elements. Furthermore, shading members 81, 81' are formed between the pixel region 23 and the peripheral circuit 25 and intercept incidence of light radiated from an active element to the photoelectric conversion part during operation of the active element. <P>COPYRIGHT: (C)2012,JPO&INPIT |
