| 发明名称 |
METHOD OF MANUFACTURING LIGHT-EMITTING DEVICE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a light-emitting device in which thermal damage on a light-emitting element can be suppressed during hot press of the light-emitting device having a glass-sealed light-emitting element mounted on a substrate. <P>SOLUTION: The method of manufacturing a light-emitting device comprises: a first step of heating a low melting point glass 4 arranged to face an upper die 61 by means of the upper die 61 heated to a temperature higher than the yield temperature of the low melting point glass 4; and a second step of sealing an LED element 2 mounted on an Al<SB POS="POST">2</SB>O<SB POS="POST">3</SB>substrate 3 with the low melting point glass 4 by pressing the low melting point glass 4 and the Al<SB POS="POST">2</SB>O<SB POS="POST">3</SB>substrate 3 supported on a lower die 51 while facing each other in a state where the low melting point glass 4 is heated above the yield temperature. <P>COPYRIGHT: (C)2012,JPO&INPIT |
| 申请公布号 |
JP2012064787(A) |
申请公布日期 |
2012.03.29 |
| 申请号 |
JP20100208147 |
申请日期 |
2010.09.16 |
| 申请人 |
TOYODA GOSEI CO LTD;SUMITA OPTICAL GLASS INC |
发明人 |
YAMAGUCHI SEIJI;TAKAKU KOJI;TAJIMA HIROYUKI;WADA SATOSHI;MORIYAMA MIKI;AIDA KAZUYA;WATABE HIROMI |
| 分类号 |
H01L33/56 |
主分类号 |
H01L33/56 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
