发明名称 |
POLYAMIDE RESIN COMPOSITION AND METHOD FOR MOLDING THE SAME |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a xylylenediamine sebacamide-based polyamide resin composition with a quick rate of crystallization and excellent in molding efficiency. <P>SOLUTION: This polyamide resin composition contains a polyamide resin (A) obtained from xylylenediamine and sebacic acid, and a polyamide 66 (B), wherein the melting point of the polyamide 66 (B) is higher by more than 50°C than that of the polyamide resin (A), and further the temperature difference between the crystallization temperature of the polyamide resin (A) and that of the polyamide 66 (B) is 50°C or lower. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012062417(A) |
申请公布日期 |
2012.03.29 |
申请号 |
JP20100208713 |
申请日期 |
2010.09.17 |
申请人 |
MITSUBISHI GAS CHEMICAL CO INC |
发明人 |
TAMURA MASAKI;MORIMOTO KAORU |
分类号 |
C08L77/06;B29C45/00;B29K77/00 |
主分类号 |
C08L77/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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