发明名称 POLYAMIDE RESIN COMPOSITION AND METHOD FOR MOLDING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a xylylenediamine sebacamide-based polyamide resin composition with a quick rate of crystallization and excellent in molding efficiency. <P>SOLUTION: This polyamide resin composition contains a polyamide resin (A) obtained from xylylenediamine and sebacic acid, and a polyamide 66 (B), wherein the melting point of the polyamide 66 (B) is higher by more than 50&deg;C than that of the polyamide resin (A), and further the temperature difference between the crystallization temperature of the polyamide resin (A) and that of the polyamide 66 (B) is 50&deg;C or lower. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012062417(A) 申请公布日期 2012.03.29
申请号 JP20100208713 申请日期 2010.09.17
申请人 MITSUBISHI GAS CHEMICAL CO INC 发明人 TAMURA MASAKI;MORIMOTO KAORU
分类号 C08L77/06;B29C45/00;B29K77/00 主分类号 C08L77/06
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