| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition and a semiconductor device excellent in soldering resistance. <P>SOLUTION: The epoxy resin composition is used for semiconductor sealing and includes (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, (D) one or more tetrasubstituted organophosphorus compounds chosen from a tetrasubstituted phosphonium salt (d1), a phosphobetaine compound (d2), and an addition product (d3) of a phosphine compound and a quinone compound, and (E) water. Moreover, the semiconductor device is characterized in that a semiconductor element is sealed by a cured product of the epoxy resin composition. <P>COPYRIGHT: (C)2012,JPO&INPIT |
