发明名称 |
INTEGRATED CIRCUIT COMPRISING A DEVICE WITH A VERTICAL MOBILE ELEMENT INTEGRATED IN A SUPPORT SUBSTRATE AND METHOD FOR PRODUCING THE DEVICE WITH A MOBILE ELEMENT |
摘要 |
The integrated circuit comprises a support substrate having opposite first and second main surfaces. A cavity passes through the support substrate and connects the first and second main surfaces. The integrated circuit comprises a device with a mobile element, the mobile element and a pair of associated electrodes of which are included in a cavity. An anchoring node of the mobile element is located at the level of the first main surface. The integrated circuit comprises a first elementary chip arranged at the level of the first main surface and electrically connected to the device with a mobile element.
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申请公布号 |
US2012074527(A1) |
申请公布日期 |
2012.03.29 |
申请号 |
US201113230035 |
申请日期 |
2011.09.12 |
申请人 |
COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIESALTERNATIVES;STMICROELECTRONICS (CROLLES 2) SAS;STMICROELECTRONICS SA |
发明人 |
CASSET FABRICE;CADIX LIONEL;COUDRAIN PERCEVAL;FARCY ALEXIS;CHAPELON LAURENT-LUEC;FELK YACINE;ANCEY PASCAL |
分类号 |
H01L29/06;H01L21/283 |
主分类号 |
H01L29/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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