Optical device for e.g. extreme UV projection exposure system for manufacturing semiconductor chips, has sensor device comprising sensor line, where sensor device is formed to examine optic during shift of holder for exposure on wafer

摘要

The device has an imaging optic (9) for imaging an object field (5) into an image field (10). A structure-prone mask (7) is arranged by a reticle holder (8) in a reticle scanning direction (21) in a region of an object plane (6) of the imaging optic. The mask includes a measuring structure imaged on a sensor device. The sensor device comprises a sensor line with sensor elements. The sensor device is formed to examine the imaging optic during shift of a substrate holder (13) for exposure on a wafer (12). Independent claims are also included for the following: (1) a method for examination of an imaging optic (2) a method for manufacturing micro- or nanostructure components.