发明名称 |
A METHOD OF FORMING THICK METAL-PLATE USE OF APPARATUS FOR FORMING OF THICK METAL-PLATE HAVING A VARIABLE BLOCK ASSEMBLY |
摘要 |
PURPOSE: A thick plate molding method using a thick plate molding apparatus with a variable block assembly is provided to enable molding of various types of thick plates, thereby reducing manufacturing costs. CONSTITUTION: A thick plate molding method comprises the steps of: preparing a thick plate molding apparatus(S100), setting a variable block assembly in upper and lower molds(S200), placing a thick plate between the upper and lower molds(S300), and transferring the upper or/and lower molds to press the thick plate with the end of the variable block assembly(S400).
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申请公布号 |
KR20120030617(A) |
申请公布日期 |
2012.03.29 |
申请号 |
KR20100092224 |
申请日期 |
2010.09.20 |
申请人 |
KOREA INSTITUTE OF MACHINERY & MATERIALS |
发明人 |
LEE, JUNG HWAN;LEE, JUNG MIN;KIM, BYUNG MIN;KIM, DAE SOON;KWON, IL KEUN;KONG, KYOUNG LYOL |
分类号 |
B21D11/20;B21D5/06;B21D31/00;B21D37/02 |
主分类号 |
B21D11/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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