| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive tape capable of surely controlling adhesion to a lead frame and separation from the lead frame, and a method for manufacturing a semiconductor device using the pressure-sensitive adhesive tape. <P>SOLUTION: A pressure-sensitive adhesive tape 20 for a resin seal for use in manufacture of a resin seal-type semiconductor device 21 includes a base material layer and an adhesive layer superposed on the base material layer. In the pressure-sensitive adhesive tape 20, force of adhesion to a lead frame 11 at 180° peel under atmosphere at 0°C is in the range of 0.01 to 10.0 N/19 mm width. Specifically, the pressure-sensitive adhesive tape 20 is used to be stuck on the backside of the lead frame 11 when a semiconductor chip 15 loaded on the front side of the lead frame 11 is sealed with a resin and to be peeled after sealing. <P>COPYRIGHT: (C)2012,JPO&INPIT |
