| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a cutting working device capable of suppressing contamination to the rear face of a wafer during edge trimming processing. <P>SOLUTION: A cutting working device 1 comprises: a chuck table 4 which has a support part having a support face for supporting the wafer formed thereon, and an annular suction part that holds the rear face of the wafer supported by the support face in a suction manner and is annularly formed; spinner cleaning means 10 which has a holding part having a holding face for holding the wafer formed thereon, and a cleaning nozzle for supplying washing water to the surface and the rear face of the wafer held by the holding part; and transportation means 12. The outer diameter of the holding part is made smaller than the inner diameter of the annular suction part, so that the holding part holds the wafer so that a portion sucked by the annular suction part of the rear face of the wafer exposes. The transportation means 12 has an edge clamp transportation mechanism having at least two clamp claws 121 which clamp the edge of the wafer. <P>COPYRIGHT: (C)2012,JPO&INPIT |
