| 发明名称 |
SEMICONDUCTOR PACKAGE INCLUDING CAP |
| 摘要 |
A semiconductor package comprises: a substrate comprising a semiconductor device; a cap comprising a seal ring disposed over a surface of the cap; and a gap between the substrate and the surface of the cap. The seal ring comprises a tread comprising at least two columns.
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| 申请公布号 |
US2012074555(A1) |
申请公布日期 |
2012.03.29 |
| 申请号 |
US20100893044 |
申请日期 |
2010.09.29 |
| 申请人 |
SNYDER RICK;PHILLIBER JOEL;AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD. |
发明人 |
SNYDER RICK;PHILLIBER JOEL |
| 分类号 |
H01L23/06;H01L23/04;H01L23/20;H01L23/48 |
主分类号 |
H01L23/06 |
| 代理机构 |
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代理人 |
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