发明名称 Tool Management Method of Die Bonder and Die Bonder
摘要 RFID tags are attached to tools of a preform head, a bonding head, and a push-up unit, and information related to each tool such as a dimension of a processing-target die is stored into the RFID tags. When a tool is mounted, an operator inputs manufacturing conditions related to the tool. On the other hand, when the information related to the tool read from the RFID tag by an RFID reader/writer and the manufacturing conditions related to the tool do not match each other, a message about wrong mounting of the tool is displayed on a monitor. Further, an operation history of the tool is written into the RFID tag by the RFID reader/writer when the production is completed. The operation history is read when the next production is started, and if the values of the operation history exceed predetermined numbers of times, a message is displayed on the monitor. Accordingly, the tools are automatically managed to lighten the work load of an operator, and wrong mounting of the tools can be prevented in a die bonder in which the tools are replaceable.
申请公布号 US2012075079(A1) 申请公布日期 2012.03.29
申请号 US201113043820 申请日期 2011.03.09
申请人 TAKAGI SUSUMU;MAKI HIROSHI;HITACHI HIGH-TECH INSTRUMENTS CO., LTD. 发明人 TAKAGI SUSUMU;MAKI HIROSHI
分类号 H04Q5/22 主分类号 H04Q5/22
代理机构 代理人
主权项
地址