发明名称 |
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE |
摘要 |
To divide a semiconductor wafer by stealth dicing, a test pad in a cutting region and an alignment target are collectively arranged along one side in a width direction of the cutting region, and a laser beam for forming a modified region is irradiated to a position away in plane from the test pad and the alignment target Am. In this manner, defects in cutting shape in a cutting process of a semiconductor wafer using stealth dicing can be reduced or prevented.
|
申请公布号 |
US2012077332(A1) |
申请公布日期 |
2012.03.29 |
申请号 |
US201113310170 |
申请日期 |
2011.12.02 |
申请人 |
ABE YOSHIYUKI;MIYAZAKI CHUICHI;MUTOU HIDEO;HIGASHINO TOMOKO;RENESAS ELECTRONICS CORPORATION |
发明人 |
ABE YOSHIYUKI;MIYAZAKI CHUICHI;MUTOU HIDEO;HIGASHINO TOMOKO |
分类号 |
H01L21/78 |
主分类号 |
H01L21/78 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|