发明名称 |
METHOD OF MANUFACTURING LIGHT EMITTING DIODE PACKAGE |
摘要 |
An exemplary method of manufacturing an LED package includes providing a base, the base having a reflecting cup with a receiving recess defined therein; an LED chip is then mounted on the base and secured in a bottom of the receiving recess; thereafter, a dispensing nozzle is used to apply an encapsulating material into the receiving recess to encapsulate the LED chip; finally, the encapsulating material is baked to form an encapsulating layer. The dispensing nozzle moves relative to the receiving recess during the application of the encapsulating material. A depth of the receiving recess is varied. Parameters of the application of the encapsulating material into the receiving recess by the dispensing nozzle vary in response to a change of the depth of the receiving recess. |
申请公布号 |
US2012077292(A1) |
申请公布日期 |
2012.03.29 |
申请号 |
US201113157318 |
申请日期 |
2011.06.10 |
申请人 |
CHANG CHAO-HSIUNG;HU PI-CHIANG;ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. |
发明人 |
CHANG CHAO-HSIUNG;HU PI-CHIANG |
分类号 |
H01L33/52;H01L33/60 |
主分类号 |
H01L33/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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