Sealing compound manufacturing method for LED, involves heating and stamping two sealing compound layers and phosphor powder to form compact component that is cut from sealing compound layers and phosphor powder to form covering of LED

摘要

The method involves applying a sealing compound layer (100), and applying phosphor powder (200) on a surface of the sealing compound layer, where the phosphor powder is evenly distributed. Another sealing compound layer is applied (300) on the phosphor powder that is clamped between the sealing compound layers made of silicone. The sealing compound layers and the phosphor powder are heated and stamped (400) to form a compact component. The compact component is cut (500) from the sealing compound layers and the phosphor powder in order to form covering of an LED. An independent claim is also included for a cover arrangement for an LED.