HIGH DENSITY MULTI-CHIP LED DEVICES

摘要

High density multi-chip LED devices (600, 700, 800, 900, 1100, 1200) are described. Embodiments of the present invention provide high-density, multi-chip LED devices (600, 700, 800, 900, 1100, 1200) with relatively high efficiency and light output in a compact size. An LED device (600, 700, 800, 900, 1100, 1200) includes a plurality of interconnected LED chips (610, 612, 710, 712, 810, 812, 910, 911, 912, 913, 1120, 1121, 1221, 1240) and an optical element such as a lens (1150). The LED chips (610, 612, 710, 712, 810, 812, 910, 911, 912, 913, 1120, 1121, 1221, 1240) may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device (600, 700, 800, 900, 1100, 1200) includes a submount (500, 1000), which may be made of ceramic. The submount (500, 1000) may include a connection bus and semicircular areas to which chips are bonded. Wire bonds (614, 616, 618, 620, 716, 718, 720, 814, 816, 820, 914, 916, 917, 918, 920, 921, 1122, 1123, 1125, 1126, 1221, 1240, 1242, 1244) can be connected to the LED chips (610, 612, 710, 712, 810, 812, 910, 911, 912, 913, 1120, 1121, 1221, 1240) so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption.