发明名称 OPTICAL MODULE AND ASSEMBLY METHOD FOR THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide an optical module which enables a heat radiation contact surface of a heat radiation cover comprising a housing of the optical module to be thermally connected with a heat radiation surface part on a rear surface of a ceramic package comprising an optical subassembly with a simple and inexpensive structure and effectively radiates heat, and to provide an assembly method of the optical module. <P>SOLUTION: In an optical module, an optical subassembly 21 on which a photoelectric converter is mounted, a circuit board 15 on which a group of electronic components for receiving and transmitting electric signals are mounted, and the likes are covered with a heat radiation cover 11. The optical subassembly 21 on which at least a light emitting element is mounted is formed by a ceramic package 22. A heat radiation surface 25 on a rear surface of the ceramic package is arranged to intersect with a heat radiation contact surface of the heat radiation cover 11, and a heat radiation block 16 is thermally connected with the heat radiation surface 25 on the rear surface of the ceramic package. Further, the heat radiation block 16 is slidably fixed to a heat radiation contact surface 11b of the heat radiation cover 11 so as to closely contact therewith. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012064936(A) 申请公布日期 2012.03.29
申请号 JP20110178930 申请日期 2011.08.18
申请人 SUMITOMO ELECTRIC IND LTD 发明人 ISHII KUNIYUKI;KURASHIMA HIROMI
分类号 H01L33/64;G02B6/42 主分类号 H01L33/64
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