| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for grinding a wafer, capable of reducing a grinding processing time and the risk of damage to a wafer during handling thereof. <P>SOLUTION: A method for grinding a wafer, in which a back surface of the wafer is ground to form a circular recessed portion and to form an annular projecting portion surrounding the circular recessed portion, comprises: a first grinding step in which the back surface of the wafer is ground by using a first grinding wheel containing abrasive grains of #320 or more and #400 or less to leave a circular recessed portion 114 and an annular projecting portion 116 surrounding the circular recessed portion 114; a second grinding step in which a bottom surface of the first circular recessed portion 114 is ground by positioning a second grinding wheel containing abrasive grains of #1000 or more and #2000 or less to the inside of the outer peripheral wall of the first circular recessed portion 114 to form a second circular recessed portion 114A; and a third grinding step in which a bottom surface of the second circular recessed portion is ground by positioning a third grinding wheel containing abrasive grains of #3000 or more to the inside of the outer peripheral wall of the second circular recessed portion to form a third circular recessed portion 114B. <P>COPYRIGHT: (C)2012,JPO&INPIT |
