MANUFACTURING METHOD OF SEMICONDUCTOR ELEMENT

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor element capable of using an adhesive material with strong adhesive power or an adhesive material which is hardened by heat and improving manufacturing efficiency by devising an adhesive material location and manufacturing the semiconductor element by cutting a substrate.

SOLUTION: A method of manufacturing one or more semiconductor elements comprises: a step of determining a semiconductor element formation region on the substrate; a step of determining a cutting part provided outside the semiconductor element formation region; a step of laminating an adhesive material 3 on an opposite surface of the semiconductor element formation region on the substrate and outside the cutting part; a step of laminating a support material 4 on the adhesive material 3; a step of laminating the semiconductor element on the semiconductor element formation region; and a step of cutting the cutting part on the substrate.

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