发明名称 LEAD FRAME MANUFACTURING METHOD AND LEAD FRAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a lead frame manufacturing method, capable of manufacturing a lead frame from one metal plate material, while maintaining design flexibility and high productivity. <P>SOLUTION: In the lead frame manufacturing method, by press working a strip-shaped conductor during successive feed thereof, forming parallel frame portions 1a, 1b on both sides thereof and forming part portions 3a, 3b connected to the frame portions 1a, 1b by connection portions 2a, 2b between both frame portions 1a, 1b, the connection portions 2a, 2b are configured to function as deformation portions allowing distance variations of the part portions 3a, 3b relative to the frame portions 1a, 1b, in a state of a maintained connection state between the frame portions 1a, 1b and the part portions 3a, 3b. When processing both frame portions 1a, 1b during the successive feed thereof at an identical speed, the frame portions 1a, 1b are moved in such a manner as to vary the distance of the part portions 3a, 3b relative to the frame portions 1a, 1b. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012064602(A) 申请公布日期 2012.03.29
申请号 JP20100205000 申请日期 2010.09.14
申请人 ISHIZEKI PRECISION CO LTD;ACCELERATE DEVICE CO LTD;IWATANI INTERNATL CORP 发明人 ISHIZEKI SEIJI
分类号 H01L33/62;H01L23/48 主分类号 H01L33/62
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