| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a power conversion device which easily cools a heating component in a housing case. <P>SOLUTION: A power conversion device 1 includes a laminated body 6 formed by laminating multiple semiconductor modules 2, each of which incorporates a semiconductor element 20 therein, a housing case 3 housing the laminated body 6, and a heating component 4 housed in the housing case 3. The laminated body 6 has a penetration coolant passage 60 and a creepage coolant passage 61 therein. The penetration coolant passage 60 is formed by allowing multiple penetration holes 24 of the multiple semiconductor modules 2 to be communicated with each other. Further, the creepage coolant passage 61 connects with the penetration coolant passage 60 and is formed along a heat sink 21. The laminated body 6 thermally contacts with the housing case 3. <P>COPYRIGHT: (C)2012,JPO&INPIT |
