| 发明名称 |
METHOD AND SYSTEM FOR IMPROVING RELIABILITY OF A SEMICONDUCTOR DEVICE |
| 摘要 |
A method and a system for improving reliability of a semiconductor device are provided. In one embodiment, a semiconductor device is provided comprising a semiconductor chip, a metallization layer comprising a metallic material disposed over a surface of the semiconductor chip, and an alloy layer comprising the metallic material disposed over the metallization layer. |
| 申请公布号 |
US2012074553(A1) |
申请公布日期 |
2012.03.29 |
| 申请号 |
US20100890721 |
申请日期 |
2010.09.27 |
| 申请人 |
HOSSEINI KHALIL;MAHLER JOACHIM;MENGEL MANFRED |
发明人 |
HOSSEINI KHALIL;MAHLER JOACHIM;MENGEL MANFRED |
| 分类号 |
H01L23/532;H01L21/283;H01L23/488;H01L23/495 |
主分类号 |
H01L23/532 |
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