发明名称 HEAT SINK BRACKET
摘要 A bracket for mounting a heat sink on a printed circuit board includes two supports, two rails slidably attached to the supports, four adjusting assemblies slidably attached to the rails and four positioning members extending through the supports to engage with the rails to position the rails on the supports. Positions of opposite ends of the rails in the supports are adjustable along a first direction. Each of the rails defines two spaced slide slots in opposite ends of the rail. The supports and the rails are attached to a first side of the printed circuit board. Positions of the adjusting assemblies in the slide slots are adjustable along a second direction perpendicular to the first direction. The adjusting assemblies extend through the circuit board to engage with the heat sink at a second side of the printed circuit board.
申请公布号 US2012074077(A1) 申请公布日期 2012.03.29
申请号 US20100916607 申请日期 2010.10.31
申请人 CHAN HUNG-CHOU;YE ZHEN-XING;HON HAI PRECISION INDUSTRY CO., LTD.;HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD. 发明人 CHAN HUNG-CHOU;YE ZHEN-XING
分类号 H05K7/14 主分类号 H05K7/14
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