发明名称 AMORPHOUS MULTI-COMPONENT METALLIC THIN FILM NANOLAMINATES
摘要 <p>An electronic structure comprising: (a) a first metal layer; (b) a second metal layer; (c) and at least one insulator layer located between the first metal layer and the second metal layer, wherein at least one of the metal layers comprises an amorphous multi-component metallic film. In certain embodiments, the construct is a metal-insulator-metal (MIM) diode. In other embodiments, the construct is a amorphous multi-component metallic thin film nanolaminate.</p>
申请公布号 WO2012021189(A9) 申请公布日期 2012.03.29
申请号 WO2011US35861 申请日期 2011.05.10
申请人 THE STATE OF OREGON ACTING BY AND THROUGH THE STATE BOARD OF HIGHER EDUCATION ON BEHALF OF OREGON STATE UNIVERSITY;COWELL, E., WILLIAM;WAGER, JOHN, F.;GIBBONS, BRADY, J.;KESZLER, DOUGLAS, A. 发明人 COWELL, E., WILLIAM;WAGER, JOHN, F.;GIBBONS, BRADY, J.;KESZLER, DOUGLAS, A.
分类号 H01L29/72;H01L29/861 主分类号 H01L29/72
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