| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain an electronic apparatus, a substrate assembly, and a semiconductor device, in which components are joined on a substrate in good condition. <P>SOLUTION: An electronic apparatus according to an embodiment includes: a housing; a substrate provided in the housing and having a first pad and a second pad, which are exposed on a surface; and a component having a first electrode, which is exposed on a substrate facing surface facing the surface of the substrate and is joined to the first pad through a bond, and a second electrode which is exposed on the substrate facing surface to be joined to the second pad through the bond and protrudes so as to be wider and higher than the first electrode. <P>COPYRIGHT: (C)2012,JPO&INPIT |
