| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat dissipation reflection board used for a light-emitting device, more specifically, a heat dissipation reflection board that is a heat dissipation light reflection substrate used for a light emission diode (hereinafter, referred to as LED) and can enhance the reflectance of desired specific wavelength light. <P>SOLUTION: In a heat dissipation reflection board 10 having 10 μm or more depth of an aluminum alloy layer 1 including anodic oxidation coating 2 on the surface of the aluminum alloy layer, a hole part 5 of the anodic oxidation coating includes at least two layers 4 and 7 having refraction factors different in the depth direction. The heat dissipation reflection board is a heat dissipation reflection board for LED that increases and reflects light in the anodic oxidation coating, can enhance the reflectance of desired specific wavelength light, and has a high heat dissipation characteristic. <P>COPYRIGHT: (C)2012,JPO&INPIT |
