| 发明名称 |
PHOTORESIST AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD USING THE SAME |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photoresist which strengthens adhesion by enhancing chemical bonding with a circuit, and a method of manufacturing printed circuit board by forming a high-density fine circuit using this photoresist. <P>SOLUTION: A photoresist 100 includes: a first photosensitive resin layer 101, and a second photosensitive resin layer 102 formed on the first photosensitive resin layer 101. The first photosensitive resin layer 101 contains photosensitive polymers having acid functional groups. <P>COPYRIGHT: (C)2012,JPO&INPIT |
| 申请公布号 |
JP2012063737(A) |
申请公布日期 |
2012.03.29 |
| 申请号 |
JP20110021512 |
申请日期 |
2011.02.03 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
KIM HE-JIN;KIM GOIN-SIK;CHANG SHOP LIU |
| 分类号 |
G03F7/095;G03F7/039;G03F7/09;G03F7/11;G03F7/20;H01L21/027 |
主分类号 |
G03F7/095 |
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