| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide technology by which phosphorus compounds do not inhibit curing of an addition reaction type silicone composition, even if the addition reaction type silicone composition comes into contact with a resin molded body including a phosphorus compound. <P>SOLUTION: A one-piece molded body is provided, which includes a thermoplastic resin molded body including a phosphorus compound, an addition reaction type silicone composition, and a member, and in which the thermoplastic resin molded body and the addition reaction type silicone composition come into contact, wherein a pentavalent phosphorus compound is used as the phosphorus compound. The thermoplastic resin molded body preferably includes a polybutylene terephthalate resin for thermal resistance reasons. <P>COPYRIGHT: (C)2012,JPO&INPIT |
