CONDUCTIVE ADHESIVE, AND CIRCUIT BOARD AND ELECTRONIC COMPONENT MODULE USING THE SAME

摘要

A conductive adhesive includes 10 to 90 wt % of Sn—Bi system solder powder and the remainder of an adhesive containing organic acid, and the Sn—Bi system solder powder is composed of solder particles having a particle size L1 of 20 to 30μm and solder particles having a particle size L2 of 8 to 12μm, and a mixing ratio of the Sn—Bi system solder powder is such that the solder particles having a particle size of 20 to 30μm occupy 40 to 90 wt % with respect to the whole solder powder, and the remainder is occupied by solder particles having a particle size of 8 to 12μm.