发明名称 |
METHOD FOR SELECTIVE LASER SINTERING AND SYSTEM FOR SELECTIVE LASER SINTERING SUITABLE FOR SAID METHOD |
摘要 |
The invention relates to a method for selective laser sintering and to a device for carrying out such a method. In the method for laser sintering, energy (1 to 6) is applied linearly to a cross-sectional surface (17) of the component to be produced in order to compact the powdery material. According to the invention, in the case of components comprising cross-sectional surfaces (17) that have a curved contour (20), the application of energy can be guided in a line-shaped manner following the curved contour so that the contour (20) of the workpiece that develops is continuously replicated. Advantageously, irregularities in the contour, which are caused by the raster predetermined by the laser sintering method, can thus be largely avoided. The device according to the invention for laser sintering according to said method comprises a powder delivery unit which can rotate about a rotational axis located in the interior of an annularly closed cross-section of the workpiece to be produced. |
申请公布号 |
WO2012038507(A2) |
申请公布日期 |
2012.03.29 |
申请号 |
WO2011EP66516 |
申请日期 |
2011.09.22 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT;HOFACKER, OLIVER;SCHAEFER, MARTIN |
发明人 |
HOFACKER, OLIVER;SCHAEFER, MARTIN |
分类号 |
B29C67/00 |
主分类号 |
B29C67/00 |
代理机构 |
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