| 摘要 |
<p>A wafer inspecting apparatus (1) is mainly provided with a transfer mechanism, detecting mechanisms, and a sucking/rotating mechanism. The transfer mechanism transfers a rectangular wafer (10) by placing the wafer on transfer paths (2A, 2B). The detecting mechanisms (4A-4D) are provided in pairs with the transfer mechanism between the pairs, and detect the state of the wafer. The sucking/rotating mechanism (5) is provided with four suction chucks (52A-52D), sucks the wafer (10) between the two pairs of detecting mechanisms, said wafer being on the transfer paths (2A, 2B), and returns the wafer onto the transfer paths (2A, 2B) after turning the wafer 90°.</p> |
