| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a temporary fixing agent capable of highly accurate processing, while reducing damage to a substrate, and capable of performing elimination of the substrate from a support substrate after processing at a proper heating temperature. <P>SOLUTION: The temporary fixing agent is used for temporarily fixing a semiconductor wafer (substrate) 3 to the support substrate 1 in order to process the semiconductor wafer 3, and for eliminating the semiconductor wafer 3 from the support substrate 1 by being heated after processing of the semiconductor wafer 3. The temporary fixing agent contains polycarbonate containing at least two circular bodies in a carbonate constitutional unit as a resin component. <P>COPYRIGHT: (C)2012,JPO&INPIT |
