| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve accuracy of thermal analysis. <P>SOLUTION: A thermal analysis device calculates an area of a prescribed range containing electronic components to be installed on a print circuit board, counts the number of via holes contained in the prescribed range, and calculates a first physical property with the use of the calculated area, the number of via holes and a physical property of a predetermined conductor. Furthermore, the thermal analysis device calculates an area of a conductor in the print circuit board and calculates a second physical property with the use of the percentage of the calculated area of the conductor except for the area of the region containing the electronic components, in the print circuit board and the physical property of the predetermined conductor. The thermal analysis device subsequently sets the predetermined physical property to the electronic components, and sets a heat-releasing route having the first physical property that is calculated from the electronic components in the direction of layers of the print circuit board. The thermal analysis device further sets a second property value with regard to a conductor other than the electronic components in the print circuit board, and generates a thermal analysis model to which the predetermined property value is further set with regard to an insulator in the print circuit board. <P>COPYRIGHT: (C)2012,JPO&INPIT |
