发明名称 |
Electronic device packages and methods of formation |
摘要 |
<p>Provided are electronic device packages and their methods of formation. The electronic device packages include an electronic device mounted on a substrate, a conductive via and a locally thinned region in the substrate. The invention finds application, for example, in the electronics industry for hermetic packages containing an electronic device such as an IC, optoelectronic or MEMS device.</p> |
申请公布号 |
EP1962344(B1) |
申请公布日期 |
2012.03.28 |
申请号 |
EP20080151799 |
申请日期 |
2008.02.22 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD |
发明人 |
SHERRER, DAVID;GETZ, JAMES W.;FISHER, JOHN J. |
分类号 |
H01L23/538;B81B7/00 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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