发明名称 HEAT SINK FOR PULSED HIGH-POWER LASER DIODE
摘要 A semiconductor laser module having a substrate and having at least one semiconductor laser situated on the substrate, the substrate having a layer structure which includes at least one primary layer which establishes a thermal contact with the semiconductor laser. The semiconductor laser is designed in such a way that it emits heat pulses having a minimum specific heat of approximately 3 mJ per mm2, preferably approximately 5 mJ/mm2, and having a pulse duration of approximately 100μs to approximately 2,000μs, and the primary layer has a layer thickness which is between approximately 200μm and approximately 2,000μm, preferably between approximately 400μm and approximately 2,000μm.
申请公布号 EP2433343(A1) 申请公布日期 2012.03.28
申请号 EP20100721017 申请日期 2010.05.18
申请人 ROBERT BOSCH GMBH 发明人 HERDEN, WERNER;SCHWARZ, HANS-JOCHEN;PITTROFF, WOLFGANG
分类号 H01S5/02;H01S5/024 主分类号 H01S5/02
代理机构 代理人
主权项
地址