发明名称 Minute sample processing method
摘要 <p>An object of the invention is to realize a method and an apparatus for processing and observing a minute sample which can observe a section of a wafer in horizontal to vertical directions with high resolution, high accuracy and high throughput without splitting any wafer which is a sample. In an apparatus of the invention, there are included a focused ion beam optical system (31-33) and an electron optical system (41, 42) in one vacuum container, and a minute sample (22) containing a desired area of the sample is separated by forming processing with a charged particle beam (4), and there are included a manipulator (70, 72) for extracting the separated minute sample, and a manipulator controller for driving the manipulator independently of a wafer sample stage.</p>
申请公布号 EP2043131(B1) 申请公布日期 2012.03.28
申请号 EP20080020171 申请日期 2001.09.19
申请人 HITACHI LTD. 发明人 TOKUDA, MITSUO;FUKUDA, MUNEYUKI;MITSUI, YASUHIRO;KOIKE, HIDEMI;TOMIMATSU, SATOSHI;SHICHI, HIROYASU;KASHIMA, HIDEO;UMEMURA, KAORU
分类号 G01N1/32;H01J37/305;G01N1/28;G01N23/225;G01Q10/00;G01Q30/02;G01Q30/04;G01Q30/16;G01Q30/20;H01J37/20;H01J37/256;H01J37/28;H01J37/30;H01J37/317;H01L21/66;H04L29/06;H04L29/08 主分类号 G01N1/32
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