| 摘要 |
PROBLEM TO BE SOLVED: To provide a non-contact IC recording medium with high thermal change resistance characteristics and a high inter-layer adhesion strength and causing no surface blister due to the change with time thereby keeping an excellent appearance, and a manufacturing method for the non-contact IC recording medium capable of reducing damages to electrical components such as an IC module to be loaded, flexibly coping with various kinds of the IC modules to be loaded and being efficiently manufactured. SOLUTION: A center core composed by embedding at least the IC module is constituted of an urethane prepolymer having an isocyanate group at the end and a reactive hot-melt resin composed of a latent curing agent. |
