FABRICATION METHOD FOR PRINTED CIRCUIT BOARD

摘要

PURPOSE: A manufacturing method of a printed circuit board is provided to protect a pad protective layer from an etchant by attaching a protection member on one side of the printed circuit board. CONSTITUTION: A first pad part(141) is exposed by a first opening part(151). A second pad part(142) is exposed by a second opening part(152). The first opening part and the second opening part are formed on both surfaces. A pad protective layer(160) is formed on the first pad part. A seed layer(170) is connected to the second pad part. A post bump(180) is formed on the second pad part. The post bump is connected to the seed layer. A protection member(200) is attached on one side of a printed circuit board. The seed layer exposed to the outside is removed by etching the printed circuit board. The protection member is removed.