发明名称 Semiconductor device and semiconductor package including the same
摘要 To include a plurality of pad groups each including a first data I/O pad, a first power supply pad, a second data I/O pad, and a second power supply pad arranged in order in an X direction. The first data I/O pad is connected to a first data I/O buffer, and the second data I/O pad is connected to a second data I/O buffer. The first power supply pad supplies a first power supply potential to the first and second data I/O buffers, and the second power supply pad supplies a second power supply potential to the first and second data I/O buffers. The first data I/O pad included in each of the pad groups is adjacent to the second power supply pad included in other pad group or any one of a plurality of power supply pads not included in any one of the pad groups.
申请公布号 US8144524(B2) 申请公布日期 2012.03.27
申请号 US20100923254 申请日期 2010.09.10
申请人 MIZUKANE YOSHIO;FUJISAWA HIROKI;ELPIDA MEMORY, INC. 发明人 MIZUKANE YOSHIO;FUJISAWA HIROKI
分类号 G11C7/00 主分类号 G11C7/00
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