| 摘要 |
A semiconductor device having a semiconductor substrate including a first surface and a second surface corresponding to a back surface with respect to the first surface and having first through electrodes which extend through the first surface and the second surface, semiconductor chips which are mounted over the first surface of the semiconductor substrate and each of which is constituted of a material of the same kind as the semiconductor substrate and has a circuit element electrically connected to the first through electrodes, stress relaxing sections which are provided with first conductors formed over the second surface of the semiconductor substrate and electrically connected to the first through electrodes of the semiconductor substrate and having flexibility, and external connecting terminals provided over the stress relaxing sections and connected to the first conductors respectively.
|
