发明名称 Multi-layer embedded capacitance and resistance substrate core
摘要 A multi-layer imbedded capacitance and resistance substrate core. At least one layer of resistance material is provided. The layer of resistance material has a layer of electrically conductive material embedded therein. At least one layer of capacitance material of high dielectric constant is disposed on the layer of resistance material. Thru-holes are formed by laser.
申请公布号 US8144480(B2) 申请公布日期 2012.03.27
申请号 US20100720849 申请日期 2010.03.10
申请人 DAS RABINDRA N.;LAUFFER JOHN M.;MEMIS IRVING;ROSSER STEVEN G.;ENDICOTT INTERCONNECT TECHNOLOGIES, INC. 发明人 DAS RABINDRA N.;LAUFFER JOHN M.;MEMIS IRVING;ROSSER STEVEN G.
分类号 H05K1/16 主分类号 H05K1/16
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