发明名称 THREE DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE
摘要 <p>PURPOSE: A three dimensional semiconductor is provided to stably etch a sacrificial layer by supporting a main structure with an isolation pattern. CONSTITUTION: An electrode structure is defined by a sidewall of buried insulation layers(250). A first row and a second row of vertical structures are provided between adjacent insulation layers. The first row and the second row of the vertical structures pass through the electrode structure. A separation pattern(190) is provided between the first row and the second row and includes a semiconductor isolation layer. The separation pattern is extended along the first row and the second row.</p>
申请公布号 KR20120029889(A) 申请公布日期 2012.03.27
申请号 KR20100092000 申请日期 2010.09.17
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE, CHANG HYUN;SON, BYOUNG KEUN;PARK, YOUNG WOO
分类号 H01L21/8247;H01L27/115 主分类号 H01L21/8247
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