| 发明名称 |
Wafer-level interconnect for high mechanical reliability applications |
| 摘要 |
An interconnect structure comprises a solder including nickel (Ni) and tin (Sn), with the nickel in a range of 0.01 to 0.20 percent by weight. The interconnect structure further includes an intermetallic compound (IMC) layer in contact with the solder. The (IMC) layer comprises a compound of copper and nickel. |
| 申请公布号 |
US8143722(B2) |
申请公布日期 |
2012.03.27 |
| 申请号 |
US20070867646 |
申请日期 |
2007.10.04 |
| 申请人 |
CURTIS ANTHONY;BURGESS GUY F.;JOHNSON MICHAEL;TESSIER TED;LU YUAN;FLIPCHIP INTERNATIONAL, LLC |
发明人 |
CURTIS ANTHONY;BURGESS GUY F.;JOHNSON MICHAEL;TESSIER TED;LU YUAN |
| 分类号 |
H01L23/48;H01L23/52 |
主分类号 |
H01L23/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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